Click here to close now.

Welcome!

.NET Authors: Carmen Gonzalez, Elizabeth White, Liz McMillan, Greg O'Connor, Jason Bloomberg

News Feed Item

TANAKA and MEMS CORE Conclude Joint Development Agreement and Commit to Technology Alliance



Building a mounting center for MEMS patterning using low-temperature bonding material utilizing gold particles; Contributing to acceleration of development of MEMS technology by building fab functions from prototyping to implementation of MEMS materials

The appearance of AuRoFUSE(TM) sealing frames (200 micrometers wide) printed on an 8-inch wafer
Tokyo, July 29, 2014 - (ACN Newswire) - Tanaka Holdings Co., Ltd. (a company of Tanaka Precious Metals) announced today that Tanaka Kikinzoku Kogyo K.K., which operates the Tanaka Precious Metals Group's manufacturing business, and MEMS CORE Co., Ltd. ("MEMS CORE") have concluded a joint development agreement and committed to a technology alliance for pattern formation technology used in MEMS (microelectromechanical systems) devices using submicron-sized (one ten-thousandth of a millimeter) gold particles developed by Tanaka Kikinzoku Kogyo. Based on this, Tanaka Kikinzoku Kogyo will transfer originally-owned submicron gold particle patterning technology and equipment to MEMS CORE, which will subsequently begin manufacturing pattern prototypes using submicron gold particles and undertaking sealing for MEMS manufacturers on November 1.

By receiving the transfer of gold particle patterning technology from Tanaka Kikinzoku Kogyo, MEMS CORE will obtain process technology forming the basis of gold particle sealing, and make its MEMS device technology and products more competitive by promoting joint development projects with Tanaka Kikinzoku Kogyo in the future. Furthermore, Tanaka Kikinzoku Kogyo aims to provide increased added value to products by choosing the provision of gold particle materials as its area of operations, and concentrating on the modification and development of materials. The two companies' joint development organization will enable the creation of a mounting center for fab (manufacturing facility) functions in MEMS development and the consistent provision of products from material development to device mounting for MEMS manufacturers in the future.

The creation of this business model allows customers to concentrate on the development of their own products as well as improvement of productivity. At the same time, securing outsourcing contractors for prototyping and mounting leads to the reduction of the cost of ownership of new mounting facilities related to MEMS manufacturing for MEMS manufacturers experiencing increased costs of wafer level packaging (WLP) mounting due to increased device functionality. Furthermore, the rate of technological development is expected to increase in the MEMS market, which is expected to expand further in the future.

Transfer of gold particle sealing technology and equipment

In December 2009, Tanaka Kikinzoku Kogyo announced that sealing has been made possible with the application of heat and pressure using patterns of submicron gold particles with the wire width narrowed to 10 micrometers (one millionth of a meter) in patterning using photoresist(*1), and has provided MEMS manufacturers considering gold particle sealing with product samples and material prototypes, in addition to consulting implementation of technology at no cost. As a result, the practicality of gold particle sealing has been recognized, and demand for the material provision materials has increased among MEMS manufacturers. Meanwhile, MEMS utilizes diverse combination patterns and increasing in complexity due to the use of 3D patterns combining microscopic moving parts in addition to semiconductors such as large-scale integrated circuits (LSI) on silicon substrates. Because of this, foundries with development capabilities, equipment, and excellent processing technology unique to MEMS are required in development and the manufacturing of prototypes for supporting small lot production of a diverse range of products.

MEMS CORE, a venture company from Tohoku University (a leader in MEMS research), is a foundry which provides development support specializing in MEMS devices and other services. MEMS CORE conducts a broad range of entrusted design and development, in addition to prototyping and manufacturing through a research organization in conjunction with Tohoku University Professors Masayoshi Esashi and Shuji Tanaka. MEMS CORE has equipment for aspects spanning from the design to manufacturing of MEMS, as well as manufacturing capability supporting a variety of prototyping processes, supporting the individual development of products utilizing gold particle sealing in the future. MEMS CORE's abundant experience in MEMS research and development is what has ultimately led to this joint development and transfer of technology and equipment.

Product overview of submicron gold particle paste

In December 2013, Tanaka Kikinzoku Kogyo began providing technology for the batch formation of complex micropatterns on substrates by employing high definition screen printing using AuRoFUSE(TM) submicron gold particle paste. Vacuum performance, or high airtightness in sealing, affects quality in the manufacturing of MEMS materials. AuRoFUSE(TM) is a paste-type bonding material containing a mixture of gold particles within the particle diameter controlled to be submicron sized and an organic solvent. When the sealing frame is thermo-compressed (200 degrees Celsius, 100MPa), gold particle sintered compacts are strained, densified, and high-vacuum sealed(*2). Vacuum sealing using AuRoFUSE(TM) has the following characteristics.

-- It is possible to form prints of micropatterns on gold (Au) film of silicon wafers and substrates for high heat-resistant and low-resistivity electrode bonding and sealing frames with excellent level difference absorption.
-- The printed sealing frames can create airtight seals by densifying the structure with thermocompression bonding at 200 degrees Celsius.
-- Patterns can be formed using high-definition screen printing, and processing can be reduced because there is no need to combine multiple processes such as plating, deposition and sputtering as required in the past.
-- 8-inch wafer size patterns can be formed.
-- AuRoFUSE(TM) enables work to be performed with minimal material loss because it can withstand repeated printing. It is believed that this will enable the effective lowering of the cost of key processes.

Furthermore, AuRoFUSE(TM) is expected to be useful in die bonding (a flip chip bonding method(*3)) for high output LEDs, laser diodes, etc. because it is possible to bond at 200 degrees Celsius with no load after chip mounting in the paste form, and because it has high heat dissipation properties after bonding.

(*1) A technique for implementing etching on printed circuit boards and processing micropatterns by using a photosensitive solvent that changes chemical resistance when irradiated with light.
(*2) Achieved a helium leakage of 1.0-13 Pa m3/s. That means the leakage was such that the pressure of 1 m3 rose by 0.0000000000001 Pascal per second.
(*3) Flip chip bonding method
A bonding method for directly mounting semiconductor chips on printed circuit boards without using wire by using protruding terminals (bumps) to bond electrodes. High luminance efficiency can be realized by mounting high-output LEDs and ultraviolet LEDs with this method.

Press release: http://www.acnnewswire.com/clientreports/598/0729_EN.pdf


Tanaka Holdings Co., Ltd. (Holding company of Tanaka Precious Metals)

Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Akira Tanae, President & CEO
Founded: 1885
Incorporated: 1918
Capital: 500 million yen
Employees in consolidated group: 3,895 (FY2012)
Net sales of consolidated group: 839.2 billion yen (FY2012)
Main businesses of the group: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: http://www.tanaka.co.jp/english (Tanaka Precious Metals), http://pro.tanaka.co.jp/en (Industrial products)

Tanaka Kikinzoku Kogyo K.K.

Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Akira Tanae, President & CEO
Founded: 1885
Incorporated: 1918
Capital: 500 million yen
Employees: 1,455 (FY2012)
Sales: 808.6 billion yen (FY2012)
Main businesses: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: http://pro.tanaka.co.jp/en

About the Tanaka Precious Metals

Established in 1885, the Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. In addition to strengthening corporate governance, the company aims to improve overall service to customers by ensuring efficient management and dynamic execution of operations. Tanaka Precious Metals is committed, as a specialist corporate entity, to providing a diverse range of products through cooperation among group companies.

Tanaka Precious Metals is in the top class in Japan in terms of the volume of precious metal handled, and for many years the group has developed and stably supplied industrial precious metals, in addition to providing accessories and savings commodities utilizing precious metals. As precious metal professionals, the Group will continue to contribute to enriching people's lives in the future.

The eight core companies in the Tanaka Precious Metals are as follows.

- Tanaka Holdings Co., Ltd. (pure holding company)
- Tanaka Kikinzoku Kogyo K.K.
- Tanaka Kikinzoku Hanbai K.K.
- Tanaka Kikinzoku International K.K.
- Tanaka Denshi Kogyo K.K.
- Electroplating Engineers of Japan, Limited
- Tanaka Kikinzoku Jewelry K.K.
- Tanaka Kikinzoku Business Service K.K.
.
MEMS CORE Co., Ltd.

Head office: 3-11-1 Akedori, Izumi-ku, Sendai-shi, Miyagi
Representative: Koji Homma, President
Established: 2001
Capital: 60 million yen
Employees: 25 (As of March 2013)
Sales: 300 million yen (2012)
Business lines: MEMS design, development, prototyping and manufacture, MEMS entrusted development services
Website: http://www.mems-core.com

Press inquiries
Global Sales Dept., Tanaka Kikinzoku International K.K. (TKI)
https://www.tanaka.co.jp/support/req/ks_contact_e/index.html

Source: Tanaka Holdings Co., Ltd.

Copyright 2014 ACN Newswire. All rights reserved.

More Stories By ACN Newswire

Copyright 2008 ACN Newswire. All rights reserved. Republication or redistribution of ACN Newswire content is expressly prohibited without the prior written consent of ACN Newswire. ACN Newswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
SYS-CON Events announced today that Intelligent Systems Services will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Established in 1994, Intelligent Systems Services Inc. is located near Washington, DC, with representatives and partners nationwide. ISS’s well-established track record is based on the continuous pursuit of excellence in designing, implementing and supporting nationwide clients’ mission-critical systems. ISS has completed many successful projects in Healthcare, Commercial, Manufacturing, ...
“With easy-to-use SDKs for Atmel’s platforms, IoT developers can now reap the benefits of realtime communication, and bypass the security pitfalls and configuration complexities that put IoT deployments at risk,” said Todd Greene, founder & CEO of PubNub. PubNub will team with Atmel at CES 2015 to launch full SDK support for Atmel’s MCU, MPU, and Wireless SoC platforms. Atmel developers now have access to PubNub’s secure Publish/Subscribe messaging with guaranteed ¼ second latencies across PubNub’s 14 global points-of-presence. PubNub delivers secure communication through firewalls, proxy ser...
SYS-CON Events announced today that B2Cloud, a provider of enterprise resource planning software, will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. B2cloud develops the software you need. They have the ideal tools to help you work with your clients. B2Cloud’s main solutions include AGIS – ERP, CLOHC, AGIS – Invoice, and IZUM
SYS-CON Events announced today that Tufin, the market-leading provider of Security Policy Orchestration Solutions, will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. As the market leader of Security Policy Orchestration, Tufin automates and accelerates network configuration changes while maintaining security and compliance. Tufin's award-winning Orchestration Suite™ gives IT organizations the power and agility to enforce security policy across complex, multi-vendor enterprise networks. With more than 1...
VoxImplant has announced full WebRTC support in the newest versions of its Android SDK and iOS SDK. The updated SDKs, which enable audio and video calls on mobile devices, are now compatible with the WebRTC standard to allow any mobile app to communicate with WebRTC-enabled browsers, including Google Chrome, Mozilla Firefox, Opera, and, when available, Microsoft Spartan. The WebRTC-updated SDKs represent VoxImplant's continued leadership in simplifying the development of real-time communications (RTC) services for app developers. VoxImplant (built by Zingaya, the real-time communication servi...
SYS-CON Events announced today that Cloudian, Inc., the leading provider of hybrid cloud storage solutions, will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Cloudian, Inc., is a Foster City, California - based software company specializing in cloud storage software. The main product is Cloudian, an Amazon S3-compliant cloud object storage platform, the bedrock of cloud computing systems, that enables cloud service providers and enterprises to build reliable, affordable and scalable cloud storage solu...
SYS-CON Events announced today that Gridstore™, the leader in hyper-converged infrastructure purpose-built to optimize Microsoft workloads, will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Gridstore™ is the leader in hyper-converged infrastructure purpose-built for Microsoft workloads and designed to accelerate applications in virtualized environments. Gridstore’s hyper-converged infrastructure is the industry’s first all flash version of HyperConverged Appliances that include both compute and storag...
SYS-CON Events announced today that IDenticard will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. IDenticard™ is the security division of Brady Corp (NYSE: BRC), a $1.5 billion manufacturer of identification products. We have small-company values with the strength and stability of a major corporation. IDenticard offers local sales, support and service to our customers across the United States and Canada. Our partner network encompasses some 300 of the world's leading systems integrators and security s...
SYS-CON Events announced today the IoT Bootcamp – Jumpstart Your IoT Strategy, being held June 9–10, 2015, in conjunction with 16th Cloud Expo and Internet of @ThingsExpo at the Javits Center in New York City. This is your chance to jumpstart your IoT strategy. Combined with real-world scenarios and use cases, the IoT Bootcamp is not just based on presentations but includes hands-on demos and walkthroughs. We will introduce you to a variety of Do-It-Yourself IoT platforms including Arduino, Raspberry Pi, BeagleBone, Spark and Intel Edison. You will also get an overview of cloud technologies s...
“In the past year we've seen a lot of stabilization of WebRTC. You can now use it in production with a far greater degree of certainty. A lot of the real developments in the past year have been in things like the data channel, which will enable a whole new type of application," explained Peter Dunkley, Technical Director at Acision, in this SYS-CON.tv interview at @ThingsExpo, held Nov 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA.
The best mobile applications are augmented by dedicated servers, the Internet and Cloud services. Mobile developers should focus on one thing: writing the next socially disruptive viral app. Thanks to the cloud, they can focus on the overall solution, not the underlying plumbing. From iOS to Android and Windows, developers can leverage cloud services to create a common cross-platform backend to persist user settings, app data, broadcast notifications, run jobs, etc. This session provides a high level technical overview of many cloud services available to mobile app developers, includi...
SYS-CON Events announced today that Ciqada will exhibit at SYS-CON's @ThingsExpo, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Ciqada™ makes it easy to connect your products to the Internet. By integrating key components - hardware, servers, dashboards, and mobile apps - into an easy-to-use, configurable system, your products can quickly and securely join the internet of things. With remote monitoring, control, and alert messaging capability, you will meet your customers' needs of tomorrow - today! Ciqada. Let your products take flight. For more inform...
Containers and microservices have become topics of intense interest throughout the cloud developer and enterprise IT communities. Accordingly, attendees at the upcoming 16th Cloud Expo at the Javits Center in New York June 9-11 will find fresh new content in a new track called PaaS | Containers & Microservices Containers are not being considered for the first time by the cloud community, but a current era of re-consideration has pushed them to the top of the cloud agenda. With the launch of Docker's initial release in March of 2013, interest was revved up several notches. Then late last...
Health care systems across the globe are under enormous strain, as facilities reach capacity and costs continue to rise. M2M and the Internet of Things have the potential to transform the industry through connected health solutions that can make care more efficient while reducing costs. In fact, Vodafone's annual M2M Barometer Report forecasts M2M applications rising to 57 percent in health care and life sciences by 2016. Lively is one of Vodafone's health care partners, whose solutions enable older adults to live independent lives while staying connected to loved ones. M2M will continue to gr...
SYS-CON Media announced today that @WebRTCSummit Blog, the largest WebRTC resource in the world, has been launched. @WebRTCSummit Blog offers top articles, news stories, and blog posts from the world's well-known experts and guarantees better exposure for its authors than any other publication. @WebRTCSummit Blog can be bookmarked ▸ Here @WebRTCSummit conference site can be bookmarked ▸ Here
Dave will share his insights on how Internet of Things for Enterprises are transforming and making more productive and efficient operations and maintenance (O&M) procedures in the cleantech industry and beyond. Speaker Bio: Dave Landa is chief operating officer of Cybozu Corp (kintone US). Based in the San Francisco Bay Area, Dave has been on the forefront of the Cloud revolution driving strategic business development on the executive teams of multiple leading Software as a Services (SaaS) application providers dating back to 2004. Cybozu's kintone.com is a leading global BYOA (Build Your O...
While not quite mainstream yet, WebRTC is starting to gain ground with Carriers, Enterprises and Independent Software Vendors (ISV’s) alike. WebRTC makes it easy for developers to add audio and video communications into their applications by using Web browsers as their platform. But like any market, every customer engagement has unique requirements, as well as constraints. And of course, one size does not fit all. In her session at WebRTC Summit, Dr. Natasha Tamaskar, Vice President, Head of Cloud and Mobile Strategy at GENBAND, will explore what is needed to take a real time communications ...
SYS-CON Events announced today that GENBAND, a leading developer of real time communications software solutions, has been named “Silver Sponsor” of SYS-CON's WebRTC Summit, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. The GENBAND team will be on hand to demonstrate their newest product, Kandy. Kandy is a communications Platform-as-a-Service (PaaS) that enables companies to seamlessly integrate more human communications into their Web and mobile applications - creating more engaging experiences for their customers and boosting collaboration and productiv...
SYS-CON Events announced today that BroadSoft, the leading global provider of Unified Communications and Collaboration (UCC) services to operators worldwide, has been named “Gold Sponsor” of SYS-CON's WebRTC Summit, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. BroadSoft is the leading provider of software and services that enable mobile, fixed-line and cable service providers to offer Unified Communications over their Internet Protocol networks. The Company’s core communications platform enables the delivery of a range of enterprise and consumer calling...
So I guess we’ve officially entered a new era of lean and mean. I say this with the announcement of Ubuntu Snappy Core, “designed for lightweight cloud container hosts running Docker and for smart devices,” according to Canonical. “Snappy Ubuntu Core is the smallest Ubuntu available, designed for security and efficiency in devices or on the cloud.” This first version of Snappy Ubuntu Core features secure app containment and Docker 1.6 (1.5 in main release), is available on public clouds, and for ARM and x86 devices on several IoT boards. It’s a Trend! This announcement comes just as...