|By ACN Newswire||
|July 28, 2014 11:13 PM EDT||
Building a mounting center for MEMS patterning using low-temperature bonding material utilizing gold particles; Contributing to acceleration of development of MEMS technology by building fab functions from prototyping to implementation of MEMS materials
|The appearance of AuRoFUSE(TM) sealing frames (200 micrometers wide) printed on an 8-inch wafer|
By receiving the transfer of gold particle patterning technology from Tanaka Kikinzoku Kogyo, MEMS CORE will obtain process technology forming the basis of gold particle sealing, and make its MEMS device technology and products more competitive by promoting joint development projects with Tanaka Kikinzoku Kogyo in the future. Furthermore, Tanaka Kikinzoku Kogyo aims to provide increased added value to products by choosing the provision of gold particle materials as its area of operations, and concentrating on the modification and development of materials. The two companies' joint development organization will enable the creation of a mounting center for fab (manufacturing facility) functions in MEMS development and the consistent provision of products from material development to device mounting for MEMS manufacturers in the future.
The creation of this business model allows customers to concentrate on the development of their own products as well as improvement of productivity. At the same time, securing outsourcing contractors for prototyping and mounting leads to the reduction of the cost of ownership of new mounting facilities related to MEMS manufacturing for MEMS manufacturers experiencing increased costs of wafer level packaging (WLP) mounting due to increased device functionality. Furthermore, the rate of technological development is expected to increase in the MEMS market, which is expected to expand further in the future.
Transfer of gold particle sealing technology and equipment
In December 2009, Tanaka Kikinzoku Kogyo announced that sealing has been made possible with the application of heat and pressure using patterns of submicron gold particles with the wire width narrowed to 10 micrometers (one millionth of a meter) in patterning using photoresist(*1), and has provided MEMS manufacturers considering gold particle sealing with product samples and material prototypes, in addition to consulting implementation of technology at no cost. As a result, the practicality of gold particle sealing has been recognized, and demand for the material provision materials has increased among MEMS manufacturers. Meanwhile, MEMS utilizes diverse combination patterns and increasing in complexity due to the use of 3D patterns combining microscopic moving parts in addition to semiconductors such as large-scale integrated circuits (LSI) on silicon substrates. Because of this, foundries with development capabilities, equipment, and excellent processing technology unique to MEMS are required in development and the manufacturing of prototypes for supporting small lot production of a diverse range of products.
MEMS CORE, a venture company from Tohoku University (a leader in MEMS research), is a foundry which provides development support specializing in MEMS devices and other services. MEMS CORE conducts a broad range of entrusted design and development, in addition to prototyping and manufacturing through a research organization in conjunction with Tohoku University Professors Masayoshi Esashi and Shuji Tanaka. MEMS CORE has equipment for aspects spanning from the design to manufacturing of MEMS, as well as manufacturing capability supporting a variety of prototyping processes, supporting the individual development of products utilizing gold particle sealing in the future. MEMS CORE's abundant experience in MEMS research and development is what has ultimately led to this joint development and transfer of technology and equipment.
Product overview of submicron gold particle paste
In December 2013, Tanaka Kikinzoku Kogyo began providing technology for the batch formation of complex micropatterns on substrates by employing high definition screen printing using AuRoFUSE(TM) submicron gold particle paste. Vacuum performance, or high airtightness in sealing, affects quality in the manufacturing of MEMS materials. AuRoFUSE(TM) is a paste-type bonding material containing a mixture of gold particles within the particle diameter controlled to be submicron sized and an organic solvent. When the sealing frame is thermo-compressed (200 degrees Celsius, 100MPa), gold particle sintered compacts are strained, densified, and high-vacuum sealed(*2). Vacuum sealing using AuRoFUSE(TM) has the following characteristics.
-- It is possible to form prints of micropatterns on gold (Au) film of silicon wafers and substrates for high heat-resistant and low-resistivity electrode bonding and sealing frames with excellent level difference absorption.
-- The printed sealing frames can create airtight seals by densifying the structure with thermocompression bonding at 200 degrees Celsius.
-- Patterns can be formed using high-definition screen printing, and processing can be reduced because there is no need to combine multiple processes such as plating, deposition and sputtering as required in the past.
-- 8-inch wafer size patterns can be formed.
-- AuRoFUSE(TM) enables work to be performed with minimal material loss because it can withstand repeated printing. It is believed that this will enable the effective lowering of the cost of key processes.
Furthermore, AuRoFUSE(TM) is expected to be useful in die bonding (a flip chip bonding method(*3)) for high output LEDs, laser diodes, etc. because it is possible to bond at 200 degrees Celsius with no load after chip mounting in the paste form, and because it has high heat dissipation properties after bonding.
(*1) A technique for implementing etching on printed circuit boards and processing micropatterns by using a photosensitive solvent that changes chemical resistance when irradiated with light.
(*2) Achieved a helium leakage of 1.0-13 Pa m3/s. That means the leakage was such that the pressure of 1 m3 rose by 0.0000000000001 Pascal per second.
(*3) Flip chip bonding method
A bonding method for directly mounting semiconductor chips on printed circuit boards without using wire by using protruding terminals (bumps) to bond electrodes. High luminance efficiency can be realized by mounting high-output LEDs and ultraviolet LEDs with this method.
Press release: http://www.acnnewswire.com/clientreports/598/0729_EN.pdf
Tanaka Holdings Co., Ltd. (Holding company of Tanaka Precious Metals)
Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Akira Tanae, President & CEO
Capital: 500 million yen
Employees in consolidated group: 3,895 (FY2012)
Net sales of consolidated group: 839.2 billion yen (FY2012)
Main businesses of the group: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: http://www.tanaka.co.jp/english (Tanaka Precious Metals), http://pro.tanaka.co.jp/en (Industrial products)
Tanaka Kikinzoku Kogyo K.K.
Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Akira Tanae, President & CEO
Capital: 500 million yen
Employees: 1,455 (FY2012)
Sales: 808.6 billion yen (FY2012)
Main businesses: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
About the Tanaka Precious Metals
Established in 1885, the Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. In addition to strengthening corporate governance, the company aims to improve overall service to customers by ensuring efficient management and dynamic execution of operations. Tanaka Precious Metals is committed, as a specialist corporate entity, to providing a diverse range of products through cooperation among group companies.
Tanaka Precious Metals is in the top class in Japan in terms of the volume of precious metal handled, and for many years the group has developed and stably supplied industrial precious metals, in addition to providing accessories and savings commodities utilizing precious metals. As precious metal professionals, the Group will continue to contribute to enriching people's lives in the future.
The eight core companies in the Tanaka Precious Metals are as follows.
- Tanaka Holdings Co., Ltd. (pure holding company)
- Tanaka Kikinzoku Kogyo K.K.
- Tanaka Kikinzoku Hanbai K.K.
- Tanaka Kikinzoku International K.K.
- Tanaka Denshi Kogyo K.K.
- Electroplating Engineers of Japan, Limited
- Tanaka Kikinzoku Jewelry K.K.
- Tanaka Kikinzoku Business Service K.K.
MEMS CORE Co., Ltd.
Head office: 3-11-1 Akedori, Izumi-ku, Sendai-shi, Miyagi
Representative: Koji Homma, President
Capital: 60 million yen
Employees: 25 (As of March 2013)
Sales: 300 million yen (2012)
Business lines: MEMS design, development, prototyping and manufacture, MEMS entrusted development services
Global Sales Dept., Tanaka Kikinzoku International K.K. (TKI)
Source: Tanaka Holdings Co., Ltd.
Copyright 2014 ACN Newswire. All rights reserved.
SYS-CON Events announced today that SOA Software, an API management leader, will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. SOA Software is a leading provider of API Management and SOA Governance products that equip business to deliver APIs and SOA together to drive their company to meet its business strategy quickly and effectively. SOA Software’s technology helps businesses to accelerate their digital channels with APIs, drive partner adoption, monetize their assets, and achieve a...
Oct. 31, 2014 07:15 PM EDT Reads: 2,099
SYS-CON Events announced today that Aria Systems, the recurring revenue expert, has been named "Bronze Sponsor" of SYS-CON's 15th International Cloud Expo®, which will take place on November 4-6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Aria Systems helps leading businesses connect their customers with the products and services they love. Industry leaders like Pitney Bowes, Experian, AAA NCNU, VMware, HootSuite and many others choose Aria to power their recurring revenue business and deliver exceptional experiences to their customers.
Oct. 31, 2014 06:30 PM EDT Reads: 2,168
SYS-CON Events announced today that AgilePoint, the leading provider of Microsoft-centric Business Process Management software, will exhibit at SYS-CON's 2nd International @ThingsExpo which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. AgilePoint is the leading provider of Microsoft-based Business Process Management (BPM) software products, has 1,300+ on-premise and cloud deployments in 25+ countries and provides the same advanced BPM feature set as J2EE vendors like IBM and Appian for the Microsoft .NET native environment. AgilePoint customer...
Oct. 31, 2014 05:00 PM EDT Reads: 1,225
The Internet of Things (IoT) promises to evolve the way the world does business; however, understanding how to apply it to your company can be a mystery. Most people struggle with understanding the potential business uses or tend to get caught up in the technology, resulting in solutions that fail to meet even minimum business goals. In his session at Internet of @ThingsExpo, Jesse Shiah, CEO / President / Co-Founder of AgilePoint Inc., will show what is needed to leverage the IoT to transform your business. He will discuss opportunities and challenges ahead for the IoT from a market and tec...
Oct. 31, 2014 04:00 PM EDT Reads: 1,596
SYS-CON Events announced today that Utimaco will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Utimaco is a leading manufacturer of hardware based security solutions that provide the root of trust to keep cryptographic keys safe, secure critical digital infrastructures and protect high value data assets. Only Utimaco delivers a general-purpose hardware security module (HSM) as a customizable platform to easily integrate into existing software solutions, embed business logic and build s...
Oct. 31, 2014 03:00 PM EDT Reads: 1,953
One of the biggest challenges when developing connected devices is identifying user value and delivering it through successful user experiences. In his session at Internet of @ThingsExpo, Mike Kuniavsky, Principal Scientist, Innovation Services at PARC, will describe an IoT-specific approach to user experience design that combines approaches from interaction design, industrial design and service design to create experiences that go beyond simple connected gadgets to create lasting, multi-device experiences grounded in people’s real needs and desires.
Oct. 31, 2014 02:00 PM EDT Reads: 1,822
SYS-CON Events announced today that TeleStax, the main sponsor of Mobicents, will exhibit at Internet of @ThingsExpo, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. TeleStax provides Open Source Communications software and services that facilitate the shift from legacy SS7 based IN networks to IP based LTE and IMS networks hosted on private (on-premise), hybrid or public clouds. TeleStax products include Restcomm, JSLEE, SMSC Gateway, USSD Gateway, SS7 Resource Adaptors, SIP Servlets, Rich Multimedia Services, Presence Services/RCS, Diame...
Oct. 31, 2014 09:00 AM EDT Reads: 1,703
Samsung VP Jacopo Lenzi, who headed the company's recent SmartThings acquisition under the auspices of Samsung's Open Innovaction Center (OIC), answered a few questions we had about the deal. This interview was in conjunction with our interview with SmartThings CEO Alex Hawkinson. IoT Journal: SmartThings was developed in an open, standards-agnostic platform, and will now be part of Samsung's Open Innovation Center. Can you elaborate on your commitment to keep the platform open? Jacopo Lenzi: Samsung recognizes that true, accelerated innovation cannot be driven from one source, but requires a...
Oct. 31, 2014 09:00 AM EDT Reads: 3,380
The Internet of Things will greatly expand the opportunities for data collection and new business models driven off of that data. In her session at Internet of @ThingsExpo, Esmeralda Swartz, CMO of MetraTech, will discuss how for this to be effective you not only need to have infrastructure and operational models capable of utilizing this new phenomenon, but increasingly service providers will need to convince a skeptical public to participate. Get ready to show them the money! Speaker Bio: Esmeralda Swartz, CMO of MetraTech, has spent 16 years as a marketing, product management, and busin...
Oct. 31, 2014 09:00 AM EDT Reads: 2,338
Things are being built upon cloud foundations to transform organizations. This CEO Power Panel at 15th Cloud Expo, moderated by Roger Strukhoff, Cloud Expo and @ThingsExpo conference chair, will address the big issues involving these technologies and, more important, the results they will achieve. How important are public, private, and hybrid cloud to the enterprise? How does one define Big Data? And how is the IoT tying all this together?
Oct. 31, 2014 08:45 AM EDT Reads: 1,992
We certainly live in interesting technological times. And no more interesting than the current competing IoT standards for connectivity. Various standards bodies, approaches, and ecosystems are vying for mindshare and positioning for a competitive edge. It is clear that when the dust settles, we will have new protocols, evolved protocols, that will change the way we interact with devices and infrastructure. We will also have evolved web protocols, like HTTP/2, that will be changing the very core of our infrastructures. At the same time, we have old approaches made new again like micro-services...
Oct. 31, 2014 07:00 AM EDT Reads: 1,667
SYS-CON Events announces a new pavilion on the Cloud Expo floor where WebRTC converges with the Internet of Things. Pavilion will showcase WebRTC and the Internet of Things. The Internet of Things (IoT) is the most profound change in personal and enterprise IT since the creation of the Worldwide Web more than 20 years ago. All major researchers estimate there will be tens of billions devices--computers, smartphones, tablets, and sensors – connected to the Internet by 2020. This number will continue to grow at a rapid pace for the next several decades.
Oct. 30, 2014 05:30 PM EDT Reads: 2,215
The only place to be June 9-11 is Cloud Expo & @ThingsExpo 2015 East at the Javits Center in New York City. Join us there as delegates from all over the world come to listen to and engage with speakers & sponsors from the leading Cloud Computing, IoT & Big Data companies. Cloud Expo & @ThingsExpo are the leading events covering the booming market of Cloud Computing, IoT & Big Data for the enterprise. Speakers from all over the world will be hand-picked for their ability to explore the economic strategies that utility/cloud computing provides. Whether public, private, or in a hybrid form, clo...
Oct. 30, 2014 05:30 PM EDT Reads: 1,448
SYS-CON Events announced today that Gridstore™, the leader in software-defined storage (SDS) purpose-built for Windows Servers and Hyper-V, will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Gridstore™ is the leader in software-defined storage purpose built for virtualization that is designed to accelerate applications in virtualized environments. Using its patented Server-Side Virtual Controller™ Technology (SVCT) to eliminate the I/O blender effect and accelerate applications Gridsto...
Oct. 30, 2014 02:00 PM EDT Reads: 2,609
SYS-CON Events announced today that Red Hat, the world's leading provider of open source solutions, will exhibit at Internet of @ThingsExpo, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Red Hat is the world's leading provider of open source software solutions, using a community-powered approach to reliable and high-performing cloud, Linux, middleware, storage and virtualization technologies. Red Hat also offers award-winning support, training, and consulting services. As the connective hub in a global network of enterprises, partners, a...
Oct. 30, 2014 12:15 PM EDT Reads: 2,088
As the Internet of Things unfolds, mobile and wearable devices are blurring the line between physical and digital, integrating ever more closely with our interests, our routines, our daily lives. Contextual computing and smart, sensor-equipped spaces bring the potential to walk through a world that recognizes us and responds accordingly. We become continuous transmitters and receivers of data. In his session at Internet of @ThingsExpo, Andrew Bolwell, Director of Innovation for HP’s Printing and Personal Systems Group, will discuss how key attributes of mobile technology – touch input, senso...
Oct. 30, 2014 12:00 PM EDT Reads: 1,773
The Internet of Things (IoT) is making everything it touches smarter – smart devices, smart cars and smart cities. And lucky us, we’re just beginning to reap the benefits as we work toward a networked society. However, this technology-driven innovation is impacting more than just individuals. The IoT has an environmental impact as well, which brings us to the theme of this month’s #IoTuesday Twitter chat. The ability to remove inefficiencies through connected objects is driving change throughout every sector, including waste management. BigBelly Solar, located just outside of Boston, is trans...
Oct. 30, 2014 11:00 AM EDT Reads: 2,200
Connected devices and the Internet of Things are getting significant momentum in 2014. In his session at Internet of @ThingsExpo, Jim Hunter, Chief Scientist & Technology Evangelist at Greenwave Systems, will examine three key elements that together will drive mass adoption of the IoT before the end of 2015. The first element is the recent advent of robust open source protocols (like AllJoyn and WebRTC) that facilitate M2M communication. The second is broad availability of flexible, cost-effective storage designed to handle the massive surge in back-end data in a world where timely analytics...
Oct. 30, 2014 08:00 AM EDT Reads: 1,635
Internet of @ThingsExpo Silicon Valley announced on Thursday its first 12 all-star speakers and sessions for its upcoming event, which will take place November 4-6, 2014, at the Santa Clara Convention Center in California. @ThingsExpo, the first and largest IoT event in the world, debuted at the Javits Center in New York City in June 10-12, 2014 with over 6,000 delegates attending the conference. Among the first 12 announced world class speakers, IBM will present two highly popular IoT sessions, which will take place November 4-6, 2014 at the Santa Clara Convention Center in Santa Clara, Calif...
Oct. 30, 2014 07:30 AM EDT Reads: 2,308
From a software development perspective IoT is about programming "things," about connecting them with each other or integrating them with existing applications. In his session at @ThingsExpo, Yakov Fain, co-founder of Farata Systems and SuranceBay, will show you how small IoT-enabled devices from multiple manufacturers can be integrated into the workflow of an enterprise application. This is a practical demo of building a framework and components in HTML/Java/Mobile technologies to serve as a platform that can integrate new devices as they become available on the market.
Oct. 29, 2014 02:15 PM EDT Reads: 2,085