Welcome!

Microsoft Cloud Authors: Pat Romanski, Srinivasan Sundara Rajan, Glenn Rossman, Janakiram MSV, Steven Mandel

News Feed Item

Tanaka Precious Metals Commences Providing Samples of High-performance Copper Bonding Wire and Silver Bonding Wire Aimed at Mass Production This Spring

Replacing Gold Bonding Wire Used in Automotive Materials and LEDs, etc.

Tokyo, Jan 10, 2013 - (ACN Newswire) - Tanaka Holdings Co., Ltd. (a company of Tanaka Precious Metals) today announced that Tanaka Denshi Kogyo K.K. of Tanaka Precious Metals, which boasts the world's leading share in the manufacture of bonding wire (wiring material, hereinafter "wire"), will commence the provision of samples of CA-1 copper wire with the reliability 1.5 times than conventional products and SEB silver wire with electrical conductivity improved by approximately 60% on January 11.

CA-1 and SEB are able to provide the necessary performance at a low cost as alternatives for gold wire that is currently used widely in semiconductor wiring not only in general purpose devices such as personal computers and smartphones, but also devices requiring high performance such as automotive electronics.

- CA-1 Bare Copper Bonding Wire
-- With the reliability 1.5 times than conventional products, this copper wire excels in all aspects of productivity, bondability, cost and electrical conductivity

CA-1 is bare copper wire with reliability improved to 1.5 times addressing the weaknesses of conventional bare copper wire. As a result of testing the failure rate at the high temperature of 175 degrees Celsius (when resistance increases 20%), it was found that while the failure rate of conventional bare copper wire started rising from 0% after 800 hours, CA-1 maintained a failure rate of 0% even after 1,200 hours, confirming that it has 1.5 times the reliability of conventional wire(*1).

Tanaka Denshi Kogyo mass produces both bare and precious metal-coated copper wire. Because the bare type is susceptible to oxidation, it presents issues such as low reliability and low productivity due to the narrow process window (tolerance range) that is a condition of stitch bonding (wire bonding to the substrates). Meanwhile, the precious metal-coated type presents issues such as tending to damage aluminum electrodes (resulting in low adhesion) due to the hardness of the ball (the round melted part at the tip of the wire) and being a more expensive type of copper wire. In order to resolve these issues, CA-1 was newly developed by creating an alloy under optimal conditions using 99.99% copper and a trace amount of metal, which realized the following features.

-- Reliability: 1.5 times the reliability of conventional bare type and achieve the same level as precious metal-coated wire
-- Productivity: Higher productivity due to the stitch bonding process window is approximately 1.5 times wider than conventional bare wire
-- Bondability: No damage to aluminum electrodes on IC (integrated circuit) chips due to the optimization of ball softness
-- Cost: Costs reduced by approximately 20% compared to precious metal-coated wire (*2)

With the current elevated gold prices, copper wire as an alternative to gold wire has begun to be widely used as wiring material for ICs and LSI (large-scale integration) circuits in general purpose devices such as personal computers and smartphones primarily from the perspective of reliability. In addition to these applications, CA-1 is able to significantly reduce manufacturing costs while sufficiently meeting the required performance by replacing the currently widely used gold wire in applications requiring high reliability, such as automotive electronics and industrial equipment.

- SEB Silver Bonding Wire
-- Electrical conductivity improved by approximately 60%, enabling costs to be reduced by 80% with almost equivalent performance as gold wire

SEB is a silver wire with electrical conductivity improved by approximately 60% compared to the existing SEA silver wire. Although SEA is able to reduce precious metals costs by approximately 80%(*3) compared to gold wire, and offers excellent bondability and productivity on par with gold wire, its weakness was having lower electrical conductivity (higher electrical resistance) than gold wire. In order to overcome this weakness, further improvements were made to the alloy combination that contributed to raising the electrical resistance. SEA's electrical resistance of approximately 5.2 micro ohm centimeters (microhm-cm) was improved to approximately 3.3 microhm-cm in SEB as a result, providing the world's first wire with the same level of electrical resistance as gold wire(*4). The features of SEB are as follows.

-- Electrical conductivity: Improved by approximately 60% compared to conventional products, which is
almost the same level as gold wire (improvement from SEA)
-- Cost: Precious metals costs can be reduced by approximately 80 % compared to gold wire
-- Bondability: No damage to aluminum electrodes due to the ball as soft as gold wire
-- Productivity: Sufficient adhesion achieved under almost the same usage conditions as gold wire
-- It is easy to switch from gold wire since it only requires safe and inexpensive nitrogen gas

The wiring material used in LEDs (light emitting diodes), ICs and LSIs is mainly gold wire, which offers excellent performance in all aspects such as electrical conductivity. SEA has mainly been used as an LED wiring material, but the improved electrical conductivity of SEB enables it to be used in ICs and LSIs of all types of electronic devices because it exhibits almost the same level of performance as gold wire at low cost.

Currently, in the bonding wire industry, gold is most widely used due to its excellent chemical properties, but gold is being replaced rapidly in areas where cheaper copper and silver can be used. Tanaka Denshi Kogyo will strengthen development of alternative materials that match customers' needs through samples provision of CA-1 and SEB that can substitute gold wire, and aims to begin mass production in the spring of 2013.

Tanaka Denshi Kogyo has scheduled to exhibit CA-1 and SEB at the 42nd Internepcon Japan, Asia's largest exhibition for electronics manufacturing and SMT, located at Tokyo Big Sight (Koto-ku, Tokyo) over three days from January 16 (Wed) until January 18 (Fri). Technical staff will constantly be on-site in the exhibit booth (East 24-26) to respond to interviews.

(*1) Value determined by the Company's measurement method.
(*2) With an order of 1,000 kilometers.
(*3) When the wire diameter is 25 micrometers (micro is 1/1,000,000).
(*4) The electrical resistance of gold wire containing 99% gold is approximately 3.1 microhm-cm.

Reference

Electrical Resistance (at 20 degrees Celsius, Unit: microhm-cm)
----------------------------------------------------------------------
Gold Silver Copper
----------------------------------------------------------------------
Electrical resistance 2.2 1.63 1.69
----------------------------------------------------------------------
Source: Metal Data Book 4th Revision (The Japan Institute of Metals)

Company release: http://www.acnnewswire.com/clientreports/513/110_EN.pdf


Tanaka Holdings Co., Ltd. (Holding company of Tanaka Precious Metals)

Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Hideya Okamoto, President & CEO
Founded: 1885
Incorporated: 1918
Capital: 500 million yen
Employees in consolidated group: 3,869 (FY2011)
Net sales of consolidated group: 1.064 trillion yen (FY2011)
Main businesses of the group: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: http://www.tanaka.co.jp/english (Tanaka Precious Metals), http://pro.tanaka.co.jp/en (Industrial products)

Tanaka Denshi Kogyo K.K.

Head office: 22F Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Koichiro Tanaka, President & CEO
Incorporated: 1961
Capital: 1,880 million yen
Employees: 142 (FY2011)
Net sales: 33.43 billion yen (FY2011)
Businesses: Manufacture of high-purity bonding wire (gold, gold alloy, aluminum, aluminum-silicon, copper, etc.)
Website: http://www.tanaka-bondingwire.com/

About the Tanaka Precious Metals

Established in 1885, the Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. In addition to strengthening corporate governance, the company aims to improve overall service to customers by ensuring efficient management and dynamic execution of operations. Tanaka Precious Metals is committed, as a specialist corporate entity, to providing a diverse range of products through cooperation among group companies.

Tanaka Precious Metals is in the top class in Japan in terms of the volume of precious metal handled, and for many years the group has developed and stably supplied industrial precious metals, in addition to providing accessories and savings commodities utilizing precious metals. As precious metal professionals, the Group will continue to contribute to enriching people's lives in the future.

The eight core companies in the Tanaka Precious Metals are as follows.
- Tanaka Holdings Co., Ltd. (pure holding company)
- Tanaka Kikinzoku Kogyo K.K.
- Tanaka Kikinzoku Hanbai K.K.
- Tanaka Kikinzoku International K.K.
- Tanaka Denshi Kogyo K.K.
- Electroplating Engineers of Japan, Limited
- Tanaka Kikinzoku Jewelry K.K.
- Tanaka Kikinzoku Business Service K.K.

Press inquiries
Global Sales Dept., Tanaka Kikinzoku International K.K. (TKI)
https://www.tanaka.co.jp/support/req/ks_contact_e/index.html

Source: Tanaka Holdings Co., Ltd.

Copyright 2013 ACN Newswire. All rights reserved.

More Stories By ACN Newswire

Copyright 2008 ACN Newswire. All rights reserved. Republication or redistribution of ACN Newswire content is expressly prohibited without the prior written consent of ACN Newswire. ACN Newswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named “Bronze Sponsor” of SYS-CON's 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management solutions, helping companies worldwide activate their data to drive more value and business insight and to transform moder...
SYS-CON Events has announced today that Roger Strukhoff has been named conference chair of Cloud Expo and @ThingsExpo 2016 Silicon Valley. The 19th Cloud Expo and 6th @ThingsExpo will take place on November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. "The Internet of Things brings trillions of dollars of opportunity to developers and enterprise IT, no matter how you measure it," stated Roger Strukhoff. "More importantly, it leverages the power of devices and the Interne...
Personalization has long been the holy grail of marketing. Simply stated, communicate the most relevant offer to the right person and you will increase sales. To achieve this, you must understand the individual. Consequently, digital marketers developed many ways to gather and leverage customer information to deliver targeted experiences. In his session at @ThingsExpo, Lou Casal, Founder and Principal Consultant at Practicala, discussed how the Internet of Things (IoT) has accelerated our abil...
Digital innovation is the next big wave of business transformation based on digital technologies of which IoT and Big Data are key components, For example: Business boundary innovation is a challenge to excavate third-party business value using IoT and BigData, like Nest Business structure innovation may propose re-building business structure from scratch, as Uber does in the taxicab industry The social model innovation is also a big challenge to the new social architecture with the design fr...
If you had a chance to enter on the ground level of the largest e-commerce market in the world – would you? China is the world’s most populated country with the second largest economy and the world’s fastest growing market. It is estimated that by 2018 the Chinese market will be reaching over $30 billion in gaming revenue alone. Admittedly for a foreign company, doing business in China can be challenging. Often changing laws, administrative regulations and the often inscrutable Chinese Interne...
So, you bought into the current machine learning craze and went on to collect millions/billions of records from this promising new data source. Now, what do you do with them? Too often, the abundance of data quickly turns into an abundance of problems. How do you extract that "magic essence" from your data without falling into the common pitfalls? In her session at @ThingsExpo, Natalia Ponomareva, Software Engineer at Google, provided tips on how to be successful in large scale machine learning...
Why do your mobile transformations need to happen today? Mobile is the strategy that enterprise transformation centers on to drive customer engagement. In his general session at @ThingsExpo, Roger Woods, Director, Mobile Product & Strategy – Adobe Marketing Cloud, covered key IoT and mobile trends that are forcing mobile transformation, key components of a solid mobile strategy and explored how brands are effectively driving mobile change throughout the enterprise.
In his session at @ThingsExpo, Kausik Sridharabalan, founder and CTO of Pulzze Systems, Inc., will focus on key challenges in building an Internet of Things solution infrastructure. He will shed light on efficient ways of defining interactions within IoT solutions, leading to cost and time reduction. He will also introduce ways to handle data and how one can develop IoT solutions that are lean, flexible and configurable, thus making IoT infrastructure agile and scalable.
Data is an unusual currency; it is not restricted by the same transactional limitations as money or people. In fact, the more that you leverage your data across multiple business use cases, the more valuable it becomes to the organization. And the same can be said about the organization’s analytics. In his session at 19th Cloud Expo, Bill Schmarzo, CTO for the Big Data Practice at EMC, will introduce a methodology for capturing, enriching and sharing data (and analytics) across the organizati...
SYS-CON Events announced today that Bsquare has been named “Silver Sponsor” of SYS-CON's @ThingsExpo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. For more than two decades, Bsquare has helped its customers extract business value from a broad array of physical assets by making them intelligent, connecting them, and using the data they generate to optimize business processes.
Internet of @ThingsExpo has announced today that Chris Matthieu has been named tech chair of Internet of @ThingsExpo 2016 Silicon Valley. The 6thInternet of @ThingsExpo will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
Cloud computing is being adopted in one form or another by 94% of enterprises today. Tens of billions of new devices are being connected to The Internet of Things. And Big Data is driving this bus. An exponential increase is expected in the amount of information being processed, managed, analyzed, and acted upon by enterprise IT. This amazing is not part of some distant future - it is happening today. One report shows a 650% increase in enterprise data by 2020. Other estimates are even higher....
A strange thing is happening along the way to the Internet of Things, namely far too many devices to work with and manage. It has become clear that we'll need much higher efficiency user experiences that can allow us to more easily and scalably work with the thousands of devices that will soon be in each of our lives. Enter the conversational interface revolution, combining bots we can literally talk with, gesture to, and even direct with our thoughts, with embedded artificial intelligence, wh...
Video experiences should be unique and exciting! But that doesn’t mean you need to patch all the pieces yourself. Users demand rich and engaging experiences and new ways to connect with you. But creating robust video applications at scale can be complicated, time-consuming and expensive. In his session at @ThingsExpo, Zohar Babin, Vice President of Platform, Ecosystem and Community at Kaltura, will discuss how VPaaS enables you to move fast, creating scalable video experiences that reach your...
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, provided an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life sett...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
19th Cloud Expo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud strategy. Meanwhile, 94% of enterpri...
Businesses are struggling to manage the information flow and interactions between all of these new devices and things jumping on their network, and the apps and IT systems they control. The data businesses gather is only helpful if they can do something with it. In his session at @ThingsExpo, Chris Witeck, Principal Technology Strategist at Citrix, will discuss how different the impact of IoT will be for large businesses, expanding how IoT will allow large organizations to make their legacy ap...
In his general session at 18th Cloud Expo, Lee Atchison, Principal Cloud Architect and Advocate at New Relic, discussed cloud as a ‘better data center’ and how it adds new capacity (faster) and improves application availability (redundancy). The cloud is a ‘Dynamic Tool for Dynamic Apps’ and resource allocation is an integral part of your application architecture, so use only the resources you need and allocate /de-allocate resources on the fly.
SYS-CON Events announced today the Enterprise IoT Bootcamp, being held November 1-2, 2016, in conjunction with 19th Cloud Expo | @ThingsExpo at the Santa Clara Convention Center in Santa Clara, CA. Combined with real-world scenarios and use cases, the Enterprise IoT Bootcamp is not just based on presentations but with hands-on demos and detailed walkthroughs. We will introduce you to a variety of real world use cases prototyped using Arduino, Raspberry Pi, BeagleBone, Spark, and Intel Edison. Y...