Welcome!

.NET Authors: Yeshim Deniz, Carmen Gonzalez, Greg O'Connor, Pat Romanski, Elizabeth White

News Feed Item

Tanaka Precious Metals Commences Providing Samples of High-performance Copper Bonding Wire and Silver Bonding Wire Aimed at Mass Production This Spring

Replacing Gold Bonding Wire Used in Automotive Materials and LEDs, etc.

Tokyo, Jan 10, 2013 - (ACN Newswire) - Tanaka Holdings Co., Ltd. (a company of Tanaka Precious Metals) today announced that Tanaka Denshi Kogyo K.K. of Tanaka Precious Metals, which boasts the world's leading share in the manufacture of bonding wire (wiring material, hereinafter "wire"), will commence the provision of samples of CA-1 copper wire with the reliability 1.5 times than conventional products and SEB silver wire with electrical conductivity improved by approximately 60% on January 11.

CA-1 and SEB are able to provide the necessary performance at a low cost as alternatives for gold wire that is currently used widely in semiconductor wiring not only in general purpose devices such as personal computers and smartphones, but also devices requiring high performance such as automotive electronics.

- CA-1 Bare Copper Bonding Wire
-- With the reliability 1.5 times than conventional products, this copper wire excels in all aspects of productivity, bondability, cost and electrical conductivity

CA-1 is bare copper wire with reliability improved to 1.5 times addressing the weaknesses of conventional bare copper wire. As a result of testing the failure rate at the high temperature of 175 degrees Celsius (when resistance increases 20%), it was found that while the failure rate of conventional bare copper wire started rising from 0% after 800 hours, CA-1 maintained a failure rate of 0% even after 1,200 hours, confirming that it has 1.5 times the reliability of conventional wire(*1).

Tanaka Denshi Kogyo mass produces both bare and precious metal-coated copper wire. Because the bare type is susceptible to oxidation, it presents issues such as low reliability and low productivity due to the narrow process window (tolerance range) that is a condition of stitch bonding (wire bonding to the substrates). Meanwhile, the precious metal-coated type presents issues such as tending to damage aluminum electrodes (resulting in low adhesion) due to the hardness of the ball (the round melted part at the tip of the wire) and being a more expensive type of copper wire. In order to resolve these issues, CA-1 was newly developed by creating an alloy under optimal conditions using 99.99% copper and a trace amount of metal, which realized the following features.

-- Reliability: 1.5 times the reliability of conventional bare type and achieve the same level as precious metal-coated wire
-- Productivity: Higher productivity due to the stitch bonding process window is approximately 1.5 times wider than conventional bare wire
-- Bondability: No damage to aluminum electrodes on IC (integrated circuit) chips due to the optimization of ball softness
-- Cost: Costs reduced by approximately 20% compared to precious metal-coated wire (*2)

With the current elevated gold prices, copper wire as an alternative to gold wire has begun to be widely used as wiring material for ICs and LSI (large-scale integration) circuits in general purpose devices such as personal computers and smartphones primarily from the perspective of reliability. In addition to these applications, CA-1 is able to significantly reduce manufacturing costs while sufficiently meeting the required performance by replacing the currently widely used gold wire in applications requiring high reliability, such as automotive electronics and industrial equipment.

- SEB Silver Bonding Wire
-- Electrical conductivity improved by approximately 60%, enabling costs to be reduced by 80% with almost equivalent performance as gold wire

SEB is a silver wire with electrical conductivity improved by approximately 60% compared to the existing SEA silver wire. Although SEA is able to reduce precious metals costs by approximately 80%(*3) compared to gold wire, and offers excellent bondability and productivity on par with gold wire, its weakness was having lower electrical conductivity (higher electrical resistance) than gold wire. In order to overcome this weakness, further improvements were made to the alloy combination that contributed to raising the electrical resistance. SEA's electrical resistance of approximately 5.2 micro ohm centimeters (microhm-cm) was improved to approximately 3.3 microhm-cm in SEB as a result, providing the world's first wire with the same level of electrical resistance as gold wire(*4). The features of SEB are as follows.

-- Electrical conductivity: Improved by approximately 60% compared to conventional products, which is
almost the same level as gold wire (improvement from SEA)
-- Cost: Precious metals costs can be reduced by approximately 80 % compared to gold wire
-- Bondability: No damage to aluminum electrodes due to the ball as soft as gold wire
-- Productivity: Sufficient adhesion achieved under almost the same usage conditions as gold wire
-- It is easy to switch from gold wire since it only requires safe and inexpensive nitrogen gas

The wiring material used in LEDs (light emitting diodes), ICs and LSIs is mainly gold wire, which offers excellent performance in all aspects such as electrical conductivity. SEA has mainly been used as an LED wiring material, but the improved electrical conductivity of SEB enables it to be used in ICs and LSIs of all types of electronic devices because it exhibits almost the same level of performance as gold wire at low cost.

Currently, in the bonding wire industry, gold is most widely used due to its excellent chemical properties, but gold is being replaced rapidly in areas where cheaper copper and silver can be used. Tanaka Denshi Kogyo will strengthen development of alternative materials that match customers' needs through samples provision of CA-1 and SEB that can substitute gold wire, and aims to begin mass production in the spring of 2013.

Tanaka Denshi Kogyo has scheduled to exhibit CA-1 and SEB at the 42nd Internepcon Japan, Asia's largest exhibition for electronics manufacturing and SMT, located at Tokyo Big Sight (Koto-ku, Tokyo) over three days from January 16 (Wed) until January 18 (Fri). Technical staff will constantly be on-site in the exhibit booth (East 24-26) to respond to interviews.

(*1) Value determined by the Company's measurement method.
(*2) With an order of 1,000 kilometers.
(*3) When the wire diameter is 25 micrometers (micro is 1/1,000,000).
(*4) The electrical resistance of gold wire containing 99% gold is approximately 3.1 microhm-cm.

Reference

Electrical Resistance (at 20 degrees Celsius, Unit: microhm-cm)
----------------------------------------------------------------------
Gold Silver Copper
----------------------------------------------------------------------
Electrical resistance 2.2 1.63 1.69
----------------------------------------------------------------------
Source: Metal Data Book 4th Revision (The Japan Institute of Metals)

Company release: http://www.acnnewswire.com/clientreports/513/110_EN.pdf


Tanaka Holdings Co., Ltd. (Holding company of Tanaka Precious Metals)

Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Hideya Okamoto, President & CEO
Founded: 1885
Incorporated: 1918
Capital: 500 million yen
Employees in consolidated group: 3,869 (FY2011)
Net sales of consolidated group: 1.064 trillion yen (FY2011)
Main businesses of the group: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: http://www.tanaka.co.jp/english (Tanaka Precious Metals), http://pro.tanaka.co.jp/en (Industrial products)

Tanaka Denshi Kogyo K.K.

Head office: 22F Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Koichiro Tanaka, President & CEO
Incorporated: 1961
Capital: 1,880 million yen
Employees: 142 (FY2011)
Net sales: 33.43 billion yen (FY2011)
Businesses: Manufacture of high-purity bonding wire (gold, gold alloy, aluminum, aluminum-silicon, copper, etc.)
Website: http://www.tanaka-bondingwire.com/

About the Tanaka Precious Metals

Established in 1885, the Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. In addition to strengthening corporate governance, the company aims to improve overall service to customers by ensuring efficient management and dynamic execution of operations. Tanaka Precious Metals is committed, as a specialist corporate entity, to providing a diverse range of products through cooperation among group companies.

Tanaka Precious Metals is in the top class in Japan in terms of the volume of precious metal handled, and for many years the group has developed and stably supplied industrial precious metals, in addition to providing accessories and savings commodities utilizing precious metals. As precious metal professionals, the Group will continue to contribute to enriching people's lives in the future.

The eight core companies in the Tanaka Precious Metals are as follows.
- Tanaka Holdings Co., Ltd. (pure holding company)
- Tanaka Kikinzoku Kogyo K.K.
- Tanaka Kikinzoku Hanbai K.K.
- Tanaka Kikinzoku International K.K.
- Tanaka Denshi Kogyo K.K.
- Electroplating Engineers of Japan, Limited
- Tanaka Kikinzoku Jewelry K.K.
- Tanaka Kikinzoku Business Service K.K.

Press inquiries
Global Sales Dept., Tanaka Kikinzoku International K.K. (TKI)
https://www.tanaka.co.jp/support/req/ks_contact_e/index.html

Source: Tanaka Holdings Co., Ltd.

Copyright 2013 ACN Newswire. All rights reserved.

More Stories By ACN Newswire

Copyright 2008 ACN Newswire. All rights reserved. Republication or redistribution of ACN Newswire content is expressly prohibited without the prior written consent of ACN Newswire. ACN Newswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories

SUNNYVALE, Calif., Oct. 20, 2014 /PRNewswire/ -- Spansion Inc. (NYSE: CODE), a global leader in embedded systems, today added 96 new products to the Spansion® FM4 Family of flexible microcontrollers (MCUs). Based on the ARM® Cortex®-M4F core, the new MCUs boast a 200 MHz operating frequency and support a diverse set of on-chip peripherals for enhanced human machine interfaces (HMIs) and machine-to-machine (M2M) communications. The rich set of periphera...

The Internet of Things (IoT) is making everything it touches smarter – smart devices, smart cars and smart cities. And lucky us, we’re just beginning to reap the benefits as we work toward a networked society. However, this technology-driven innovation is impacting more than just individuals. The IoT has an environmental impact as well, which brings us to the theme of this month’s #IoTuesday Twitter chat. The ability to remove inefficiencies through connected objects is driving change throughout every sector, including waste management. BigBelly Solar, located just outside of Boston, is trans...
SYS-CON Events announced today that Matrix.org has been named “Silver Sponsor” of Internet of @ThingsExpo, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Matrix is an ambitious new open standard for open, distributed, real-time communication over IP. It defines a new approach for interoperable Instant Messaging and VoIP based on pragmatic HTTP APIs and WebRTC, and provides open source reference implementations to showcase and bootstrap the new standard. Our focus is on simplicity, security, and supporting the fullest feature set.
Predicted by Gartner to add $1.9 trillion to the global economy by 2020, the Internet of Everything (IoE) is based on the idea that devices, systems and services will connect in simple, transparent ways, enabling seamless interactions among devices across brands and sectors. As this vision unfolds, it is clear that no single company can accomplish the level of interoperability required to support the horizontal aspects of the IoE. The AllSeen Alliance, announced in December 2013, was formed with the goal to advance IoE adoption and innovation in the connected home, healthcare, education, aut...
SYS-CON Events announced today that Red Hat, the world's leading provider of open source solutions, will exhibit at Internet of @ThingsExpo, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Red Hat is the world's leading provider of open source software solutions, using a community-powered approach to reliable and high-performing cloud, Linux, middleware, storage and virtualization technologies. Red Hat also offers award-winning support, training, and consulting services. As the connective hub in a global network of enterprises, partners, a...
The only place to be June 9-11 is Cloud Expo & @ThingsExpo 2015 East at the Javits Center in New York City. Join us there as delegates from all over the world come to listen to and engage with speakers & sponsors from the leading Cloud Computing, IoT & Big Data companies. Cloud Expo & @ThingsExpo are the leading events covering the booming market of Cloud Computing, IoT & Big Data for the enterprise. Speakers from all over the world will be hand-picked for their ability to explore the economic strategies that utility/cloud computing provides. Whether public, private, or in a hybrid form, clo...
Software AG helps organizations transform into Digital Enterprises, so they can differentiate from competitors and better engage customers, partners and employees. Using the Software AG Suite, companies can close the gap between business and IT to create digital systems of differentiation that drive front-line agility. We offer four on-ramps to the Digital Enterprise: alignment through collaborative process analysis; transformation through portfolio management; agility through process automation and integration; and visibility through intelligent business operations and big data.
Be Among the First 100 to Attend & Receive a Smart Beacon. The Physical Web is an open web project within the Chrome team at Google. Scott Jenson leads a team that is working to leverage the scalability and openness of the web to talk to smart devices. The Physical Web uses bluetooth low energy beacons to broadcast an URL wirelessly using an open protocol. Nearby devices can find all URLs in the room, rank them and let the user pick one from a list. Each device is, in effect, a gateway to a web page. This unlocks entirely new use cases so devices can offer tiny bits of information or simple i...
The Transparent Cloud-computing Consortium (abbreviation: T-Cloud Consortium) will conduct research activities into changes in the computing model as a result of collaboration between "device" and "cloud" and the creation of new value and markets through organic data processing High speed and high quality networks, and dramatic improvements in computer processing capabilities, have greatly changed the nature of applications and made the storing and processing of data on the network commonplace.
The Internet of Things (IoT) is going to require a new way of thinking and of developing software for speed, security and innovation. This requires IT leaders to balance business as usual while anticipating for the next market and technology trends. Cloud provides the right IT asset portfolio to help today’s IT leaders manage the old and prepare for the new. Today the cloud conversation is evolving from private and public to hybrid. This session will provide use cases and insights to reinforce the value of the network in helping organizations to maximize their company’s cloud experience.
Things are being built upon cloud foundations to transform organizations. This CEO Power Panel at 15th Cloud Expo, moderated by Roger Strukhoff, Cloud Expo and @ThingsExpo conference chair, will address the big issues involving these technologies and, more important, the results they will achieve. How important are public, private, and hybrid cloud to the enterprise? How does one define Big Data? And how is the IoT tying all this together?
TechCrunch reported that "Berlin-based relayr, maker of the WunderBar, an Internet of Things (IoT) hardware dev kit which resembles a chunky chocolate bar, has closed a $2.3 million seed round, from unnamed U.S. and Switzerland-based investors. The startup had previously raised a €250,000 friend and family round, and had been on track to close a €500,000 seed earlier this year — but received a higher funding offer from a different set of investors, which is the $2.3M round it’s reporting."
The Industrial Internet revolution is now underway, enabled by connected machines and billions of devices that communicate and collaborate. The massive amounts of Big Data requiring real-time analysis is flooding legacy IT systems and giving way to cloud environments that can handle the unpredictable workloads. Yet many barriers remain until we can fully realize the opportunities and benefits from the convergence of machines and devices with Big Data and the cloud, including interoperability, data security and privacy.
All major researchers estimate there will be tens of billions devices - computers, smartphones, tablets, and sensors - connected to the Internet by 2020. This number will continue to grow at a rapid pace for the next several decades. Over the summer Gartner released its much anticipated annual Hype Cycle report and the big news is that Internet of Things has now replaced Big Data as the most hyped technology. Indeed, we're hearing more and more about this fascinating new technological paradigm. Every other IT news item seems to be about IoT and its implications on the future of digital busines...
Cultural, regulatory, environmental, political and economic (CREPE) conditions over the past decade are creating cross-industry solution spaces that require processes and technologies from both the Internet of Things (IoT), and Data Management and Analytics (DMA). These solution spaces are evolving into Sensor Analytics Ecosystems (SAE) that represent significant new opportunities for organizations of all types. Public Utilities throughout the world, providing electricity, natural gas and water, are pursuing SmartGrid initiatives that represent one of the more mature examples of SAE. We have s...
The Internet of Things needs an entirely new security model, or does it? Can we save some old and tested controls for the latest emerging and different technology environments? In his session at Internet of @ThingsExpo, Davi Ottenheimer, EMC Senior Director of Trust, will review hands-on lessons with IoT devices and reveal privacy options and a new risk balance you might not expect.
IoT is still a vague buzzword for many people. In his session at Internet of @ThingsExpo, Mike Kavis, Vice President & Principal Cloud Architect at Cloud Technology Partners, will discuss the business value of IoT that goes far beyond the general public's perception that IoT is all about wearables and home consumer services. The presentation will also discuss how IoT is perceived by investors and how venture capitalist access this space. Other topics to discuss are barriers to success, what is new, what is old, and what the future may hold.
Swiss innovators dizmo Inc. launches its ground-breaking software, which turns any digital surface into an immersive platform. The dizmo platform seamlessly connects digital and physical objects in the home and at the workplace. Dizmo breaks down traditional boundaries between device, operating systems, apps and software, transforming the way users work, play and live. It supports orchestration and collaboration in an unparalleled way enabling any data to instantaneously be accessed on any surface, anywhere and made interactive. Dizmo brings fantasies as seen in Sci-fi movies such as Iro...
There’s Big Data, then there’s really Big Data from the Internet of Things. IoT is evolving to include many data possibilities like new types of event, log and network data. The volumes are enormous, generating tens of billions of logs per day, which raise data challenges. Early IoT deployments are relying heavily on both the cloud and managed service providers to navigate these challenges. In her session at 6th Big Data Expo®, Hannah Smalltree, Director at Treasure Data, to discuss how IoT, Big Data and deployments are processing massive data volumes from wearables, utilities and other mach...
This Internet of Nouns trend is still in the early stages and many of our already connected gadgets do provide human benefits over the typical infotainment. Internet of Things or IoT. You know, where everyday objects have software, chips, and sensors to capture data and report back. Household items like refrigerators, toilets and thermostats along with clothing, cars and soon, the entire home will be connected. Many of these devices provide actionable data - or just fun entertainment - so people can make decisions about whatever is being monitored. It can also help save lives.