Welcome!

Microsoft Cloud Authors: Elizabeth White, Liz McMillan, Mihai Corbuleac, Pat Romanski, David Bermingham

News Feed Item

STMicroelectronics Leverages Cable Know-How to Support Next-Generation Multimedia and Internet Services

First 16x4 Capable Cable Modem DOCSIS(R) 3.0 Chips Reach Market Quickly After Successful September Technology Demonstration

GENEVA -- (Marketwire) -- 01/04/13 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading producer of ICs for cable set-top boxes and home gateways, has revealed the first three chips in its new family supporting the DOCSIS 3.0 cable-modem specification.

Since first demonstrating its DOCSIS 3.0 technology in September 2012, ST has moved quickly to introduce the 12-channel STiD125 and 16-channel STiD127 for set-top box or headed gateway front-end, and the 16-channel STiD128 for cable modems and data gateways including headed gateway front-end. These are believed to be the world's first DOCSIS 3.0 devices providing up to 16 downlink channels, with four uplink channels, enabling data speeds of up to 800Mbps downstream and 108Mbps upstream.

DOCSIS 3.0 provides the framework for home and mobile entertainment to evolve from legacy MPEG to IP video distribution. The extremely high data rates enable set-top boxes and home gateways to deliver video and internet data converged services over a single network and support simultaneous use of multiple connected devices, such as smart televisions, digital video recorders (DVRs), tablets, smartphones and game consoles in the home. With the availability of DOCSIS 3.0, industry research firm IMS has predicted the market for DOCSIS home devices will grow from 32 million units per year in 2012 to more than 49 million by 2015.

ST's DOCSIS 3.0 technology is associated with a dual-core ARM® Cortex™-A9 processor to control routing, switching and telephony functions. ST's DOCSIS 3.0 devices are taking advantage of their association with ST's advanced set top box devices such as the Orly STiH416 to provide security and media server functions, for services such as pay TV and internet-based services used in next-generation connected-home products.

"The rapid introduction of these devices leverages ST's proven expertise in this arena, as ST has already shipped tens of millions of first- and second-generation DOCSIS chips," said Laurent Remont, ST's Digital Convergence Group Vice President and Unified Platform Division General Manager. "As the first company to demonstrate 16x4-channel DOCSIS 3.0 technology, the speed with which we're launching our latest family allows operators to deliver more advanced services to multiple connected users throughout the home."

ST will release Product Development Kits (PDK) for the STiD125, STiD127 and STiD128, targeting the 23x23 BGA package, in Q1 2013.

Major features of STiD125/127/128:

  • Multiple high-speed DOCSIS 3.0 channels: up to 16x4 data, up to 8 video
  • Rich connectivity: Full Spectrum Tuner interface, up to 3 Ethernet ports, up to 2 PCI-e (Wi-Fi DBC) ports, 200Mb/s Digital Video Transport Stream output bus
  • Enhanced Internet telephony with PacketCable™ 1.5 and 2.0 support
  • Low-power, high-performance multi-core ARM processor delivering industry- best power and performance

About DOCSIS 3.0:

DOCSIS (Data Over Cable Service Interface Specifications) are the dominant cable modem specifications adopted by cable service providers and equipment suppliers in North America. The equivalent EuroDOCSIS specification is widely used throughout Europe. By supporting leading-edge data rates, successive DOCSIS specifications have enabled cable TV operators to become full-service video, voice and data telecommunications providers.

The latest version, DOCSIS 3.0, supports Internet Protocol TV (IPTV) allowing services such as on-demand content and streaming video, with static or dynamic multicasting for enhanced quality of service. It also supports the next-generation Internet Protocol (IPv6), which significantly extends the IP address range to permit more devices to connect to the Internet.
Other advances include support for channel bonding, which is a flexible technique for increasing the maximum data bandwidth of cable modems. ST's DOCSIS 2.0 compliant STi7141 supports downlink data speeds of 40Mbps, while DOCSIS 3.0 technology with channel bonding has potential for up to 800Mbps. This is a significant advantage enabling cable operators to deliver rich multimedia services and fast Internet access to multiple home users, simultaneously.

About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented.
In 2011, the Company's net revenues were $9.73 billion. Further information on ST can be found at www.st.com.

ST DOCSIS 3.0 Modem SoCs: http://hugin.info/152740/R/1668317/541683.pdf
ST DOCSIS 3.0 Modem SoCs_IMAGE: http://hugin.info/152740/R/1668317/541684.jpg

More Stories By Marketwired .

Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

@ThingsExpo Stories
The IoTs will challenge the status quo of how IT and development organizations operate. Or will it? Certainly the fog layer of IoT requires special insights about data ontology, security and transactional integrity. But the developmental challenges are the same: People, Process and Platform. In his session at @ThingsExpo, Craig Sproule, CEO of Metavine, will demonstrate how to move beyond today's coding paradigm and share the must-have mindsets for removing complexity from the development proc...
Customer experience has become a competitive differentiator for companies, and it’s imperative that brands seamlessly connect the customer journey across all platforms. With the continued explosion of IoT, join us for a look at how to build a winning digital foundation in the connected era – today and in the future. In his session at @ThingsExpo, Chris Nguyen, Group Product Marketing Manager at Adobe, will discuss how to successfully leverage mobile, rapidly deploy content, capture real-time d...
SYS-CON Events announced today that ContentMX, the marketing technology and services company with a singular mission to increase engagement and drive more conversations for enterprise, channel and SMB technology marketers, has been named “Sponsor & Exhibitor Lounge Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York. “CloudExpo is a great opportunity to start a conversation with new prospects, but what happens after the...
What a difference a year makes. Organizations aren’t just talking about IoT possibilities, it is now baked into their core business strategy. With IoT, billions of devices generating data from different companies on different networks around the globe need to interact. From efficiency to better customer insights to completely new business models, IoT will turn traditional business models upside down. In the new customer-centric age, the key to success is delivering critical services and apps wit...
Join us at Cloud Expo | @ThingsExpo 2016 – June 7-9 at the Javits Center in New York City and November 1-3 at the Santa Clara Convention Center in Santa Clara, CA – and deliver your unique message in a way that is striking and unforgettable by taking advantage of SYS-CON's unmatched high-impact, result-driven event / media packages.
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, will provide an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life ...
SYS-CON Events announced today that BMC Software has been named "Siver Sponsor" of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2015 at the Javits Center in New York, New York. BMC is a global leader in innovative software solutions that help businesses transform into digital enterprises for the ultimate competitive advantage. BMC Digital Enterprise Management is a set of innovative IT solutions designed to make digital business fast, seamless, and optimized from mainframe to mo...
SYS-CON Events announced today that MobiDev will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. MobiDev is a software company that develops and delivers turn-key mobile apps, websites, web services, and complex software systems for startups and enterprises. Since 2009 it has grown from a small group of passionate engineers and business managers to a full-scale mobile software company with over 200 develope...
SoftLayer operates a global cloud infrastructure platform built for Internet scale. With a global footprint of data centers and network points of presence, SoftLayer provides infrastructure as a service to leading-edge customers ranging from Web startups to global enterprises. SoftLayer's modular architecture, full-featured API, and sophisticated automation provide unparalleled performance and control. Its flexible unified platform seamlessly spans physical and virtual devices linked via a world...
SYS-CON Events announced today that Alert Logic, Inc., the leading provider of Security-as-a-Service solutions for the cloud, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Alert Logic, Inc., provides Security-as-a-Service for on-premises, cloud, and hybrid infrastructures, delivering deep security insight and continuous protection for customers at a lower cost than traditional security solutions. Ful...
Companies can harness IoT and predictive analytics to sustain business continuity; predict and manage site performance during emergencies; minimize expensive reactive maintenance; and forecast equipment and maintenance budgets and expenditures. Providing cost-effective, uninterrupted service is challenging, particularly for organizations with geographically dispersed operations.
As cloud and storage projections continue to rise, the number of organizations moving to the cloud is escalating and it is clear cloud storage is here to stay. However, is it secure? Data is the lifeblood for government entities, countries, cloud service providers and enterprises alike and losing or exposing that data can have disastrous results. There are new concepts for data storage on the horizon that will deliver secure solutions for storing and moving sensitive data around the world. ...
SYS-CON Events announced today TechTarget has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. TechTarget is the Web’s leading destination for serious technology buyers researching and making enterprise technology decisions. Its extensive global networ...
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named “Bronze Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management...
SYS-CON Events announced today that MangoApps will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. MangoApps provides modern company intranets and team collaboration software, allowing workers to stay connected and productive from anywhere in the world and from any device. For more information, please visit https://www.mangoapps.com/.
The essence of data analysis involves setting up data pipelines that consist of several operations that are chained together – starting from data collection, data quality checks, data integration, data analysis and data visualization (including the setting up of interaction paths in that visualization). In our opinion, the challenges stem from the technology diversity at each stage of the data pipeline as well as the lack of process around the analysis.
Designing IoT applications is complex, but deploying them in a scalable fashion is even more complex. A scalable, API first IaaS cloud is a good start, but in order to understand the various components specific to deploying IoT applications, one needs to understand the architecture of these applications and figure out how to scale these components independently. In his session at @ThingsExpo, Nara Rajagopalan is CEO of Accelerite, will discuss the fundamental architecture of IoT applications, ...
SYS-CON Events announced today that Tintri Inc., a leading producer of VM-aware storage (VAS) for virtualization and cloud environments, will exhibit at the 18th International CloudExpo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
In his session at 18th Cloud Expo, Bruce Swann, Senior Product Marketing Manager at Adobe, will discuss how the Adobe Marketing Cloud can help marketers embrace opportunities for personalized, relevant and real-time customer engagement across offline (direct mail, point of sale, call center) and digital (email, website, SMS, mobile apps, social networks, connected objects). Bruce Swann has more than 15 years of experience working with digital marketing disciplines like web analytics, social med...
A strange thing is happening along the way to the Internet of Things, namely far too many devices to work with and manage. It has become clear that we'll need much higher efficiency user experiences that can allow us to more easily and scalably work with the thousands of devices that will soon be in each of our lives. Enter the conversational interface revolution, combining bots we can literally talk with, gesture to, and even direct with our thoughts, with embedded artificial intelligence, wh...